Circuit Stability Under Process Variability and Electro-Thermal-Mechanical Coupling

Impacts of variations to be considered at various levels of simulation

Nanoelectronics for aggressively scaled More Moore, Beyond CMOS, and advanced More-than-Moore applications has to cope with physical limitaltions. Furthermore, process variability and the interaction with electrical, thermal and mechanical effects are getting increasingly important.

Modelling and simulation (TCAD) allows us to extensively study process variations and trace their effects on subsequent process steps and on devices and circuits.


- we work on overcoming the weaknesses currently limiting the use of TCAD to study process variability and its interaction with electro-thermal-mechanical effects,
- commercially available software and leading-edge background results of the project partners are are linked to newly developed software modules.
- we demonstrate the capabilities of the software system on advanced analog circuits as well as on aggressively scaled transistors.,

This project has received funding from the European Union's Seventh Framework Programme for research, technological development and demonstration under grant agreement no 318458.

Material from Workshop at ESSDERC 2015