Circuit Stability Under Process Variability and Electro-Thermal-Mechanical Coupling
Nanoelectronics for aggressively scaled More Moore, Beyond CMOS, and advanced More-than-Moore applications has to cope with physical limitations. Furthermore, process variability and the interaction with electrical, thermal and mechanical effects are getting increasingly important.
Modelling and simulation (TCAD) allows one to extensively study process variations and trace their effects on subsequent process steps and on devices and circuits.
- we worked on overcoming the weaknesses currently limiting the use of TCAD to study process variability and its interaction with electro-thermal-mechanical effects,
- commercially available software and leading-edge background results of the project partners were linked to newly developed software modules.
- we demonstrated the capabilities of the software system on advanced analog circuits as well as on aggressively scaled transistors.
The project duration was October 2012 to December 2015
Latest update of public webpage on November 11, 2016